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Our Products Semiconductor Assembly Machine


The Kaijo FB-180 and FB-780 is fully automatic wire bonder for all advanced devices include ultra fine pitch process and stacked IC. Super High-Speed Fully Automatic Bump Bonder handling Wafer up to 300mm.



ITOCHU SYSTECH SINGAPORE PTE, LTD.

136, Joo Seng Road #03-01, Singapore 368360
Tel.: 0065-63432130 Fax: 0065-68582345
E-mail: texas.loh@systech-itochu.com.sg

Copyright © 2009 ITOCHU.