Our Products Electronic Component & Module

Choose Products 1. Nexg CCD Module Products -- Page 1 -- Page 2 2. Stars LCM 3. Colver Products -- Build Up PWB Solutions -- Build Up PWB Solutions B2 4. Pikor Products -- Bluetooth Module -- Introduction of BTM applications

ITOCHU is established supplier of CCM, LCD, PCB, Bluetooth to manufacturers and design houses of Handheld Devices, HDD and PDA phone. ITOCHU provides the technical and solution advice to our customers on new product design.

Compact Camera Module (CCM) Supplier for wide range of high quality CCM manufactured in Japan and Taiwan. Unbelievable Picture Quality! Sensor Type : CMOS or CCD Resolution : VGA, 1.3M, 2.0M, 3.0M, 4.0M & Higher Focus type : Fix or Auto focus. Connectivity : Flex, B to B or customized Flex

LCD Modules Wide-ranging LCD Modules manufacturer line-up, with extensive product knowledge Features - High brightness & Excellent picture quality - Superior Color Saturation - Wide view angle - Low power consumption - Digital RGB Interface Size : 1.3", 1.5", 1.8", 2.0", 2.2", 2.4", 2.6", 3.5", 5.5", 6.4", 8.0" and other sizes Pixels : 128x128, 128x160, QCIF+, QVGA, W-QVGA & VGA View Orientation : Landscape, Portrait Form Factor : Single, Dual (With Mono/CSTN/TFT) Mode : Transmissive, Transflextive

Printed Circuit Board (PCB) Our Technology - Multi Layer Boards with IVH & BVH - Build-up boards using: -    . Buried Bump Interconnection Technology (B2IT)    . Laser Technology    . AGSP Technology - 4 to 14 layer boards with micro via - Halogen-free build-up boards - Selective OSP (OSP + Gold) surface finish - Original probe testing for 0.3mm pitch - Original visual inspection system - Impedance measuring Our Advantages - Volume production of multi PCB with IVH, BVH, B2IT, Laser via and combinations - Build-up PCB with B2IT & Laser via using Halogen-free material - UL certified for high voltage 100V on built-up PCB with B2IT - UL certified for Halogen-free material - Electroless gold plating selective OSP, water based OSP and heat sink measures

Bluetooth Module Application - Cable replacement - Portable computers, PDA - Modems - Cameras - Other type of devices that require the wireless communication provided by Bluetooth Features - Applying highly integrated LTCC technologies (BPF and Balun embedded) - 19.0x14.0x2.6mm3 of module size - Asynchronous connection-less (ACL) link support giving data rates up to 721kbps - Synchronous connection-oriented (SCO) link - Standard BlueRF bus interface - Memory organization - Communication interfaces - Ciphering support for up to 128-bit key - Separate control for external power amplifier for power class 1 support